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The interposer can then be metallized from the major, bottom, and aspect to connect it to the bordering elements of the method. This would make interposers a flexible and adaptable packaging system. Sub-threshold currents and reverse diodes in the CMOS transistor in an ASIC, in addition to semiconductor leakage electrical https://semipedia25790.articlesblogger.com/38794418/the-greatest-guide-to-semipedia


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