About SiC Schottky diodes

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Rising the grinding disc pace within just a certain range can Increase the removing rate, but the higher the velocity, the worse the flatness from the substrate floor. No Built-in Product Mfg (IDM) wishes to back-grind this 500um wafer down to a thinner level for unit functionality (On Resistance). 350um https://jaidenrwyae.blogspothub.com/20018791/the-fact-about-tcigbt-that-no-one-is-suggesting


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